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Sn-Bi58 Solid Wires

Date:2013-11-23 Hitcount:10355
  • Feature
  • Detail
  • The Sn-Bi58 solder wires were fabricated by using grain refinement technology, possesed finer microstructure, uniform composition, and better soldering properties.The Sn-Bi58 eutectic alloy wires with different diameters were prepared by self-developed equipments and technology. The melting point of alloy wires is 139℃. It can meet the packaging processt of electronic components which are senstive to the soldering temperature.

  • ---- Sn-Bi58 Typical Products specification:

    Product Grade No.
    Diameter (mm)
    Packing specification ( g/Roll)
    YTW502-1.2
    1.2
    500
    YTW502-1.0
    1.0
    500
    YTW502-0.8
    0.8
    500
    YTW502-0.6
    0.6
    200 or 500
    YTW502-0.5
    0.5
    50 or 100 or 200
    YTW502-0.4
    0.4
    50 or 100
    YTW502-0.3
    0.3
    50 or 100



    ---- Compostion of Sn-Bi58 Solder wires:

    Element
    Sn
    Pb
    Cd
    Cr6+
    Bi
    Content(wt%)
    42.0±0.5
    ﹤0.1
    ﹤0.01
    ﹤0.01
    Bal

    ---- Properties of Sn-Bi58 solder wires:

    Diameter (mm)
    Expansion rate (%)
    Tensile strength (MPa)
    Fracture elongation (%)
    1.2
    70~80
    50~70
    ≥60
    1.0
    70~80
    50~70
    ≥60
    0.8
    70~80
    50~70
    ≥60
    0.6
    70~80
    50~70
    ≥40
    0.5
    70~80
    50~70
    ≥40
    0.4
    70~80
    50~70
    ≥30
    0.3
    70~80
    50~70
    ≥30


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